| Theatrical Release Date: October 8, 2008 Cast: Directed by: Synopsis: |
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Everyone from a dangerous crime lord to a sexy accountant, a corrupt politician and down-on-their-luck petty thieves conspire, collude and collide with one another in an effort to get rich quick. Check out official website here –>Link |
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Archive for August, 2008
J. TECH - Aug - 22nd
J. TECH - Aug - 20th
By Shane McGlaun – August 20, 2008
Wireless USB is one of the new technologies that has been touted for while, but has yet to show up in force in consumer devices. In theory, wireless USB is pretty slick allowing computer users to connect to peripherals like cameras and printers without having to connect a physical USB cable. Wireless USB got a shot in arm today with NEC Electronics announcing that it has expanded its wireless USB portfolio with a new host controller. The new wireless USB host controller is called the uPD720171 for PCI Express. The new host controller enables high-speed, wireless data transmission between PCs that have a minicard or Half-minicard expansion slot and peripherals like printers and digital cameras. While enabling wireless USB connectivity, the new host controller also maintains the ability to connect with wired USB devices. NEC electronics says that the new wireless USB controller is certified by the USB Implementers Forum and conforms to Wireless USB 1.0 specifications.
Read more here –>Link
J. TECH - Aug - 20th
New chips open the door to gaming rigs with a mix of ATI and NVIDIA cards
By Jason Mick – August 20, 2008
NVIDIA is busily plugging away with its 200 series and marketing various SLI solutions in the form of anything from a pair of 8000 or 9000 cards to its top end — a pair of 280 GTXs. AMD is similarly pushing its 4850/4870 CrossFire solutions along with CrossFire for its new dual-GPU 4870 X2 cards. The key thing is AMD/ATI cards are not compatible with NVIDIA cards — CrossFire and SLI are two different technologies. Furthermore, most motherboards either support SLI or support CrossFire — most don’t do both. Enter Lucid, also known as LucidLogix, a fabless semiconductor designer (meaning it outsources its chips to other company’s fabs, such as TSMC). Lucid is far from a known name in the graphics industry, though that may soon change. With the help of Intel Capital backing and over 50 patents, it has developed a technology that seems poised to rock the graphics industry. The groundbreaking technology is titled the HYDRA Engine. The accomplishment of the engine is nothing short of unbelievable to those who follow the graphics industry. It uses hardware and software to allow virtually any AMD/ATI and NVIDIA GPU to work together and share workloads with the CPU, scaling programs almost linearly. You could probably call the HYDRA Engine CrossFire-SLI, though you might run into a spot of legal trouble in trying to do so.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
J. TECH - Aug - 18th
by Wolfgang Gruener August 18, 2008
IBM and its chip development partners, including AMD, made a stunning announcement today, apparently beating Intel_Corporation in the successful production of the first functional 22_nanometer SRAM cell. 22 nm processors are still three years out in the future, but IBM’s news is a good sign that chip manufacturer will be able to easily scale to this new level by the end of 2011. It appears that, for the first time in several decades, Intel may have to put some extra time into its research and development efforts to make sure it can keep its manufacturing lead at 22 nm and beyond. SRAM chips are typically the first semiconductor devices to test a new manufacturing process as a precursor to actual microprocessors. The devices developed and manufactured by AMD, Freescale_Semiconductor , IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE) were built in a traditional six-Transistor design on a 300 mm wafer and had a memory cell size of just 0.1 ?m2, which compares to Intel’s 45 nm SRAM cell size (the test chip that was used for today’s 45_nanometer processors) of 0.346 ?m2.
Read more here –>Link
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